Module Introduction

LEC-PX30

SMARC – SGET

LEC-PX30–SMARC–ADLINK

The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

SGET – Standardization Group for Embedded Technologies

SMARC module and carrier specifications are
available online at : https://www.sget.org/standards/smarc.html

Specifications

Core System

SoC

Rockchip PX30 with Quad-core ARM Cortex-A35 CPU TrustZone technology support ARMv8 Cryptography Extensions”

Memory

1GB or 2GB DDR3L at 1066/1333 MHz, memory down (non ECC)

L2 Cache

256KB unified system L2 cache

IoT security

CryptoAuthentication™ Device, Microchip ATECC608A

Cryptographic co-processor with secure hardware-based key storage for sign-verify authentication provides Internet of Things (IoT) Protected
Storage for up to 16 keys, certificates or data ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman NIST standard P256, elliptic curve support SHA-256 & HMAC hash including off-chip context save/restore AES-128: encrypt/decrypt, galois field multiply for GCM”

Video

LEC-PX30 standard display support is limited to either 4-lane MIPI DSI or single channel 24-bit LVDS. DSI and LVDS are multiplexed and either of them can simply be enabled at boot time. HDMI panel support up to 1920x1080 resolution can be achieved by using a simple bridge on the carrier. A reference design based on ADV7335 “MIPI/DSI Receiver with HDMI Transmitter” is available

GPU Core:

Mali-G31

GPU Feature Support

Supports DirectX 11 FL9_3, OpenGLES 1.1/ 2.0 / 3.2, Vulkan 1.0, OpenCL 2.0

Full Profile Video decoding: H.264 up to 1080p@60fps, H.265/HEVC up to 1080p@60fps

MPEG-4, ISO/IEC 14496-2, SP@L0-3, ASP@L0-5, up to 1080p@60fps VP8, up to 1080p@60fps

Video Encoding: H.264 video encoder at BP/MP/HP@level 4.2 1920x1080@30fps, 1x 1080p@30fps or 2x 720p@30fps encoding

MIPI DSI

MIPI DSI 4 lanes at max. 1080p@60fps display output (default, multiplexed with LVDS signal)

LVDS

LVDS single channel 24-bit at max. 1280x800@60fps (multiplexed with MIPI DSI signal)

Camera

MIPI CSI RX Interface

- Compatible with the MIPI Alliance Interface specification v1.0

- Up to 4 data lanes, 1.0Gbps maximum data rate per lane, supporting MIPI-HS, MIPI-LP mode

Audio

Supports ES8316 codec for high performance and low power multi-bit deltasigma

audio ADC and DAC (located on carrier)

Dual Ethernet

Primary LAN

MAC 10/100 Ethernet Controller on SoC
Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex

Secondary LAN

MAC/PHY 10/100 Ethernet Controller on LAN9514 via USB 2.0
Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex

Extension busses

USB

4x USB 2.0, 1x USB OTG

UART

Two UART interfaces SER0 and SER2 (TX/X/CTS/RTS), 64-byte FIFO and support for 5-bit, 6-bit, 7-bit, 8-bit data transmit or receive

CAN bus

Supports CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

SPI

2x SPI (one occupied by SPI-to-CAN controller)

I2S

2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

I2C

Four I2C interfaces

- Support for 7-bit and 10-bit address mode

- Software programmable clock frequency of 100 kbit/s in Standard-mode,

400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

12x GPIO with interrupt, one GPIO with PWM

System Storage

SDIO

1x SDIO (4-bit) compatible with SD3.0, MMC ver. 4.51

eMMC

8, 16, 32 or 64 GB (build option)
Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1

SEMA® Board Management Controller

Voltage/current monitoring, boot configuration, logistics and forensic

information, flat panel control, watchdog timer

Debug Header

30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration

Power

Supply Voltage

4.75 V – 5.25 V

Mechanical and Environmental

Form Factor

SGET SMARC Specifications v2.1

Dimension

SMARC short size module, 82mm x 50mm

Operating Temperature

Standard: 0°C to +60°C

Rugged: -20°C to +85°C (optional)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,

Condition A and Method 214A, Table 214-I, Condition D