LEC-IMX8MP SMARC 2.1.1 module with I-Pi SMARC Plus Carrier Board

Industrial Prototyping Kit for IoT/AIoT with Off-the-Shelf SMARC Computer-on-Module

SMARC 2.1.1 Carrier Board with M.2 Extension.

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  • Equipped with SMARC 2.1.1 compliant, specially designed for
    industrial embedded applications requiring long life, high MTBF and
    strict revision control
  • Includes everything needed to go live in minutes
  • Industrial grade quality and 15 year product availability
  • Supports Android, Ubuntu and Yocto OS


Graphics and Camera

​ 1x HDMI 1.4b / 2.0b

​ 1x eDP 1.3 (bom option)

​ 1x MIPI-DSI 4 lanes

​ 1x MIPI-CSI dual lane interface

​ 1x MIPI-CSI quad lane interface


​ Interchangeable audio codec connector with I2S and HDA signals

Dual Ethernet

​ 1x 10/100/1000 RJ45 connector

​ 1x 10/100/1000 RJ45 connector

Expansion Busses

​ 2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG connectors

​ 4x UART interfaces SER2 (TX/X/CTS/RTS) and SER0, SER1, SER3 (TX/RX)

​ 2x CAN 2 interface pin headers

​ 2x SPI pin headers

​ 1x I²S interface to audio interface

​ 2x I²C interface on pin header

​ 14x GPIO with interrupt on pin header

​ M.2 B-key and M.2 E-key expansion slots for additional storage or communication

​ Micro SD card slot

​ SIM card slot


​ 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0


​ 19Vdc input via barrel connector

Mechanical and Environmental

​ Form Factor: SGET SMARC Specifications 2.1

​ Dimensions: 110 mm x 110 mm

​ Operating Temperature:

​ Standard: 0°C to +60°C

​ Rugged: -40°C to +85°C (optional)

​ Humidity:

​ 5-90% RH operating, non-condensing

​ 5-95% RH storage (and operating with conformal coating)

​ Shock and Vibration:

​ IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

​ Method 213B, Table 213-I, Condition A and Method 214A,

​ Table 214-I, Condition D


​ Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Block Diagram