Carrier Board Introduction

I-Pi-SMARC with SMARC 2.1 Small Form Carrier Board

image-20201013150420667

Features

  • SMARC revision 2.1 compliant

  • LVDS, DSI and HDMI graphic output interfaces

  • Dual GbE ports and USB 2.0 / USB 3.0 interfaces

  • I2S audio codec interface

  • 40-pin MRAA compliant signal header

  • Rugged operating temperature (option): -40°C to +85°C

  • 10 year product availability


Specifications

Video

  • 1x HDMI 1.4b / 2.0b
  • 1x MIPI-DSI 4 lanes
  • 1x MIPI-CSI dual lane interface

I2S audio codec

Dual Ethernet

  • Primary LAN: 1x 10/100/1000 RJ45 connector
  • Secondary LAN: 1x 10/100/1000 RJ45 connector

Expansion Busses

  • 2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG connectors
  • 2x UART interfaces SER2 (CTS/RTS) and SER0 (CTS/RTS)
  • 1x CAN 2 interface pin headers
  • 2x SPI pin headers
  • 1x I²S interface to audio interface
  • 2x I²C interface on pin header
  • 14x GPIO with interrupt on pin header

Storage

  • 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

Power

  • 12Vdc input via barrel connector

Mechanical and Environmental

  • Form Factor: SGET SMARC Specifications 2.1

  • Dimensions: 116 mm x 81 mm

  • Operating Temperature:

    • Standard: 0°C to +60°C
    • Rugged: -40°C to +85°C (optional)
  • Humidity:

    • 5-90% RH operating, non-condensing
    • 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration

    • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,
      Method 213B, Table 213-I, Condition A and Method 214A,
      Table 214-I, Condition D
  • HALT

    • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test


Block Diagram

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