COM Express Type 6 module based on Meteor Lake A COM Express COM.0 R3.1 Type 6 module, named as cExpress-MTL Download User Manual COM Express Formfactor COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board. The COM Express form factor defines mini-, compact-, basic-, and extended-size modules. Each size focuses on specific application areas and power envelopes. Get more detail https://www.adlinktech.com/en/COM-Express COM Express module and carrier specification are online at https://www.picmg.org/openstandards/com-express/ Key Features of cExpress-MTL Intel Core Ultra processor. max. 16 CPU cores Intel Arc Graphic integration, max. 8 Xe cores NPU inside for AI acceleration 96GB DDR5 max. at up to 5600MT/s PCIe Gen4 & 2.5GbE Ethernet Specifications Core System Core System (SoC) Intel® Core™ Ultra processors (formerly Meteor Lake-U/H) Processor Frequency Cache TDP CPU/GPU Cores Ultra 7 165H 1.4(5.0)GHz 24MB 28W 14C/8Xe Ultra 7 155H 1.4(4.8)GHz 24MB 28W 14C/8Xe Ultra 5 135H 1.7(4.6)GHz 18MB 28W 12C/8Xe Ultra 5 125H 1.2(4.9)GHz 18MB 28W 12C/7Xe Ultra 7 165U 1.7(4.9)GHz 12MB 15W 10C/4Xe Ultra 7 155U 1.7(4.8)GHz 12MB 15W 10C/4Xe Ultra 5 135U 1.6(4.4)GHz 12MB 15W 10C/4Xe Ultra 5 125U 1.3(4.3)GHz 12MB 15W 10C/4Xe Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative. Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 3.0, Intel® AVX512-VNNI, Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI Note: Availability of features may vary between processor SKUs. Memory Up to 64GB DDR5, in-band ECC/non-ECC in two SO-DIMM, max. 5600MT/s Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel® AMT 12.x support Expansion Buses Up to 8 PCIe x1 Gen4 lanes (AB): Lanes 0/1/2/3 and Lanes 4/5/6/7 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1, lanes 6/7 by option) SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control Debug Headers 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs Management BusI2C SMBus Video GPU Feature Support Intel® Xe LPG HW AV1 encode/decode DX12 OpenGL4.6 H.265 (HEVC) 8-bit codec OneAPI Digital Display Interface 3x DDI (DP 1.4/HDMI 2.0b, VGA build option) LVDS 1x LVSD (or eDP1.4b) USB 2x USB4 in place of DDI 1/2, supports DP 2.1 by DP alternative mode, Thunderbolt 4 capable (requires BIOS code mod., by project basis) Camera MIPI CSI 4 lanes and support MIPI CSI2.0 DPHY at 2.5Gbps Audio Chipset Integrated on SoC Codec On carrier Express-BASE6 (ALC886 standard support) Ethernet Intel® MAC/PHY Intel® Ethernet Connection I226 series (I226-IT/V supports TSN by build option) Interface 2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC) Multi I/O and Storage USB 2x USB 3.2/2.0/1.1 2x USB 3.2 (BOM option) 6x USB 2.0/1.1 SATA 2x SATA 6Gb/s (SATA 0-1) Serial 2x UART with console redirection GPIO GPIO: 8 XGPIO from EC (GPI with interrupt) On-board Storage NVMe SSD in place of PEG lanes 12-16 (build option, project basis) Super I/O Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis) Trusted Platform Module (TPM) Chipset Infineon Type TPM 2.0 (SPI based) Power Standard Input ATX: 12V±5%/5Vsb±5%; or AT:12V±5% Management ACPI 5.0 compliant, Smart Battery support Power States C1-C6, 50, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO Mode Supports deep S5 mode for power saving Mechanical and Environmental Form Factor PICMG COM.0: Rev 3.1 Type 6 Dimension Compact size: 95 mm x 95 mm Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -40°C to 85°C Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Windows 10 Enterprise LTSC 2021 Yocto Linux 64-bit, VxWorks 64-bit (TBC) Ubuntu 24.04 Ordering Information Module cExpress-MTL-165H Compact COM Express Type 6 module with Meteor Lake Ultra7-MS3 165H 14 core, Intel 8 core Xe LPG graphics cExpress-MTL-155H Compact COM Express Type 6 module with Meteor Lake Ultra7-T4 155H 14 core, Intel 8 core Xe LPG graphics cExpress-MTL-125H Compact COM Express Type 6 module with Meteor Lake Ultra5-T3 125H 12 core, Intel 7 core Xe LPG graphics cExpress-MTL-135H Compact COM Express Type 6 module with Meteor Lake Ultra5-MS1 135U 12 core, Intel 8 core Xe LPG graphics Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative. Accessories Heat Spreaders HTS-cMTL-B Heatspreader for cExpress-MTL with threaded standoffs for bottom mounting HTS-cMTL-BT Heatspreader for cExpress-MTL with through-hole standoffs for top mounting Passive Heatsinks THS-cMTL-B Low-profile Heatsink for cExpress-MTL with threaded standoffs for bottom mounting THS-cMTL-BT Low-profile Heatsink for cExpress-MTL with through-hole standoffs for top mounting THSH-cMTL-B High-profile Heatsink for cExpress-MTL with threaded standoffs for bottom mounting Active Heatsinks THSF-cMTL-B High-profile Heatsink with Fan for cExpress-MTL with threaded standoffs for bottom mounting Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.