Module Introduction Download Datasheet The SMARC FormfactorThe SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm. The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key). The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. SMARC module and carrier specifications are module and carrier specifications areavailable online at : https://www.sget.org/standards/smarc SpecificationsCore SystemSoC NXP i.MX 95 with 6x ARM Cortex-A55 cores Real-time Domain 1x Arm Cortex-M7 / System Domain 1x Arm Cortex-M33 EdgeLock secure enclave technology 2 TOPS NXP eIQ Neutron Neural Processing Unit (optional) Memory 2/4/8GB LPDDR5 L2 Cache Per core: 32KB I-Cache, 32KB D-Cache, 64KB L2 Cache and unified 512KB L3 Cache (ECC) Security NXP EdgeLock™ Secure Key Type: AES-128/192/256, ECC 256/384 Key Import/Creation/Derivation/Update/Deletion SCA-hardened Asymmetric Public Key Cryptography: RSA up to 4096; Elliptic Curve up to P-512 w/NIST curves; Brainpool P-512, P-384 SCA-hardened Symmetric Cryptography: AES-128/192/256 Modes: GCM, ECB, CBC, CTR, CCM, XCBC-MAC, KTS (256) TPM Optional TPM 2.0 security MIPI-DSI 1x MIPI-DSI 4 lanes Cameras MIPI-CSI RX Interface Compatible with the MIPI Alliance Interface specification v1.0 Up to 4 data lanes, 1.0Gbps maximum data rate per lane Supports MIPI-HS, MIPI-LP mode 1x MIPI-CSI dual lane interface 1x MIPI-CSI quad lane interface VideoGPU Core Arm® Mali™ G310 GPU Feature Support 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0 2D GPU VPU Feature Support 4K60P H.265/H.264 decode or encode 4K30P H.265/H.264 simultaneous encode & decode NPU 2 TOP/s NXP eIQ Neutron Neural Processing Unit HDMI HDMI 2.0a (BOM option) MIPI DSI DSI 4 lanes LVDS Dual Channel LVDS port 18/24 bit Camera support Compatible with MIPI Alliance Interface specification v2.1 Two MIPI-CSI2 camera inputs, one 4-lane and one 2-lane AudioAudio Codec I2S audio codec (located on carrier) Dual EthernetPrimary LAN MAC 10/100/1000 Ethernet Controller on SoC (TSN capable) Secondary LAN MAC 10/100/1000 Ethernet Controller on SoC (TSN capable) Wireless CommunicationWi-Fi IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN Bluetooth Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR) Extension BussesPCIe 2x PCIe Gen3 1X lane USB 2x USB 3.0, 2x USB 2.0, 1x USB OTG UART 4x UART interfaces SER1 and SER2 (CTS/RTS) / SER0 and SER3 (TX/RX/CTS/RTS) CAN 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps SPI 2x SPI I2S 1x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support) I2C Four I2C interfaces Support for 7-bit and 10-bit address mode Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus GPIO 14x GPIO with interrupt, one GPIO with PWM System StorageSDIO 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 eMMC 32, 64, 128 or 256 GB (build option) Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1 SEMA® Board Controller Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer Debug Header 30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration PowerInput 5Vdc +/- 5% Mechanical and EnvironmentalForm Factor SGET SMARC Specifications 2.2 Dimensions SMARC short size module, 82mm x 50mm Operating Temperature Standard: 0°C to +60°C Rugged: -40°C to +85°C (optional) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating SystemsStandard Support Yocto Linux BSP, Android Extended Support (BSP) VxWorks