COM Express Type 6 R3.1Carrier Board

Industrial Prototyping / Reference Carrier for Off-the-shelf COM Express Type 6 Module


Download Datasheet


  • PICMG COM Express Revision 3.1 Support R3.1 Type 6 modules Basic / Compact size
  • 2x USB4 at Type C
  • 4x USB 3.x, 2x USB 2.0, and 2x USB 2.0 at 9-pin header for front panel
  • Supports DisplayPort
  • LVDS and eDP*
  • 1x SD card slot*
  • 8-pin header GPIO
  • 1x RJ-45 LAN connector
  • Headers for SMBus, I2 C, LPC
  • Header for front panel usage
  • Onboard diagnostics for BIOS POST code data on LPC bus

Note: * Depends on the module



  • Onboard diagnostics for BIOS POST code data and address on LPC bus
Secondary BIOS
  • Onboard socket for secondary SPI flash


Audio Codec
  • Realtek ALC262
  • Mic/Line-in/Line-out on Rear I/O S/PDIF on Rear I/O
Digital I/O
  • SMBus to GPIO bridge


GbE controllers
  • 1x 2500/1000/100/10BASE-T compatible RJ45 on Rear I/O.


  • 1x 4-pin FAN connector (from COMe module)
  • 2x 4-pin FAN connector (from Super I/O)

Connectors and Interfaces

  • COM Express: 1x 220-pin (Type 10)
  • LVDS: 1x onboard header*
  • Display Port: 1x onboard header
  • Audio: Mic/Line-in/Line-out on I/O panel
  • SATA: 2x SATA connector (SATA_0 and SATA_1)
  • Connectors and Interfaces (one supports mSATA cards)
  • 2x USB4 at Type C on Rear I/O
  • 4x USB 3.0 on I/O panel
  • 2x USB 2.0 on I/O panel
  • 2x USB 2.0 at 9-pin header for front panel
Expansion busses
  • 1x PCI Express x16 slot
  • 1x PCI Express x4 slot
  • 4x PCI Express x1 slot
  • 4x SATA (with power for SATA device).
  • Only 2x SATA connector (SATA_0 and SATA_1) supported by the Express ADP Module
Serial Port
  • 1x DB-9 (from Super I/O) on Rear I/O
  • 3x 10-pin header
  • 8-pin header GPIO, SD card slot*
Module control bus
  • SMBus, I2C
  • DB15 on Rear I/O*
Flat Panel
  • 34-pin header LVDS (build option for eDP)*
  • BTN (ON/OFF, Reset, SLEEP, LID), LED, Buzzer
  • Reset button
  • Lid button
  • Sleep button
  • Power button


  • 100-240V

Mechanical and Environmental

  • Form Factor: PICMG® COM Express® Revision 2.1 (Supports Type 10 modules in Mini form factor)

  • Dimensions: 150 mm x 142 mm

  • Operating Temperature:

    • Standard: 0°C to 60°C
    • Rugged: -40°C to 85°C (optional)
  • Humidity:

    • 5-90% RH operating, non-condensing

    • 5-95% RH storage (and operating with conformal coating)

  • Shock and Vibration:

    • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,
    • Method 213B, Table 213-I, Condition A and Method 214A,
    • Table 214-I, Condition D
  • HALT

    • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Functional Diagram