COM Express Type 6 module based on Panther LakeA COM Express COM.0 R3.1 Type 6 module, named as Express-PTL Download User Manual COM Express FormfactorCOM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board. The COM Express form factor defines mini-, compact-, basic-, and extended-size modules. Each size focuses on specific application areas and power envelopes. Get more detail https://www.adlinktech.com/en/COM-Express COM Express module and carrier specification are online at https://www.picmg.org/openstandards/com-express/ Key Features of Express-PTL Intel Core Ultra Series 3 Processor. max. 16 CPU cores Intel Arc Xe Graphic integration, max. 12 Xe cores Intel® NPU 5.0 inside for AI acceleration 128GB DDR5 max. at up to 7200MT/s PCIe Gen4 & 2.5GbE Ethernet SpecificationsCore SystemCore System (SoC) Intel® Core™ Ultra Series 3 processors (formerly Panther Lake) Processor Frequency Cache TDP CPU/GPU Cores Ultra X7 358H 1.9(4.8)GHz 18MB 25W 16C (4P+8E+4LPE)/12Xe3 Ultra 7 356H 1.9(4.7)GHz 18MB 25W 16C (4P+8E+4LPE)/4Xe3 Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative. Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 3.0, Intel® AVX512-VNNI, Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI Note: Availability of features may vary between processor SKUs. Memory Up to 128GB DDR5, in-band ECC/non-ECC in two SO-DIMM, max. 7200MT/s Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel® AMT 12.x support Expansion Buses Up to 8 PCIe x1 Gen4 lanes (AB): Lanes 0/1/2/3 and Lanes 4/5/6/7 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1, lanes 6/7 by option) SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control Debug Headers 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs Management BusI2C SMBus VideoGPU Feature Support Intel® Arc Xe3 LPG HW AV1 encode/decode DX12 OpenGL4.6 H.265 (HEVC) 8-bit codec OneAPI Digital Display Interface 3x DDI (DP 2.1/HDMI 2.0b, VGA build option) LVDS 1x LVSD (or eDP1.4b) USB 2x USB4 in place of DDI 1/2, supports DP 2.1 by DP alternative mode, Thunderbolt 4 capable (requires BIOS code mod., by project basis) CameraMIPI CSI 4 lanes and support MIPI CSI2.0 DPHY at 2.5Gbps AudioChipset Integrated on SoC Codec On carrier Express-BASE6 (ALC886 standard support) EthernetIntel® MAC/PHY Intel® Ethernet Connection I226 series (I226-IT/V supports TSN by build option) Interface 2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC) Multi I/O and StorageUSB 4x USB 3.2/2.0/1.1 4x USB 2.0/1.1 SATA 4x SATA 6Gb/s (SATA 0-3) Serial 2x UART with console redirection GPIO GPIO: 8 XGPIO from EC (GPI with interrupt) On-board Storage NVMe SSD in place of PEG lanes 12-16 (build option, project basis) Super I/O Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis) Trusted Platform Module (TPM)Chipset Infineon Type TPM 2.0 (SPI based) PowerStandard Input ATX: 12V±5%/5Vsb±5%; or AT:12V±5% Management ACPI 5.0 compliant, Smart Battery support Power States C1-C6, 50, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO Mode Supports deep S5 mode for power saving Mechanical and EnvironmentalForm Factor PICMG COM.0: Rev 3.1 Type 6 Dimension Basic Size: 125 mm x 95 mm Operating Temperature Standard: 0°C to 60°C Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating SystemsStandard Support Windows 11 Enterprise LTSC 2024 Yocto Linux 64-bit, VxWorks 64-bit (TBC) Ubuntu 24.04 LTS Ordering InformationModuleExpress-PTL-358H COM Express Type 6 Basic size module with Panther Lake X7 358H 16 core, Intel® Arc™ Xe3 Graphics 12 core, and Intel® NPU 5.0 Express-PTL-356H COM Express Type 6 Basic size module with Panther Lake 7 356H 16 core, Intel® Xe3 Graphics 4 core, and Intel® NPU 5.0 Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative. AccessoriesHeat SpreadersHTS-PTL-B Heatspreader for Express-PTL with threaded standoffs for bottom mounting HTS-PTL-BT Heatspreader for Express-PTL with through-hole standoffs for top mounting Passive HeatsinksTHS-PTL-B Low-profile Heatsink for Express-PTL with threaded standoffs for bottom mounting THS-PTL-BT Low-profile Heatsink for Express-PTL with through-hole standoffs for top mounting THSH-PTL-B High-profile Heatsink for Express-PTL with threaded standoffs for bottom mounting Active HeatsinksTHSF-PTL-B High-profile Heatsink with Fan for Express-PTL with threaded standoffs for bottom mounting Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.