OverviewDev KitsDevelopment kits come with an open-standard Computer-on-Module consisting the core elements such as the CPU and memory, along with a general-purpose carrier board with pre-defined I/O interfaces, such as PCIe, USB, and display. Dev kits empower customers to not only test out the performance process of new silicon as they come out, but also prototype for custom, application-specific solutions, turning innovative ideas into proof of concept. Type 6 Panther Lake Dev KitADLINK’s Panther Lake COM Express Type 6 is an out-of-the-box ready development kit, including a COM.0 R3.1-compliant COM Express Module + Carrier + Heatsink, that is powered by Intel® Core Ultra Series 3 Processor Utilizing Intel’s advanced hybrid architecture with up to 4 Performance-cores (P-cores), for IoT workloads and maximum responsiveness, and 8 Efficient-cores (E-cores), for offload multitasking and addition 4 Low Power Efficient-cores (LP E-cores) , it effectively optimizes productivity and can fuel IoT innovations across various power envelopes, making it well-suited for deployments requiring high performance while maintaining low power, including industrial automation and control, medical ultra sound, image processing and analysis, high speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, and more. The dev kit’s module features up to Intel Arc graphic 12 Xe3-cores (358H) and NPU, up to 128GB DDR5 SO-DIMM, up to 4x 4K displays via DDI/LVDS (eDP, VGA, USB4 build option), 1x PCIe x8 Gen4 (356H), 1x PCIe x4 Gen4 plus 3x PCIe x1 lanes, 2.5GbE Ethernet, 4x USB 3.2 Gen2/2.0, 4x USB 2.0, up to 4x SATA. The module is also available with rugged operating temperature with selected CPU SKUs.