COM Express Type 6 R3.1Carrier Board Industrial Prototyping / Reference Carrier for Off-the-shelf COM Express Type 6 Module This page aims to highlight the capabilities of the COM Express Type 6 R3.1 Carrier Board. For a more comprehensive information, please refer to its user manual. Download User Manual Features Supports R3.1 Type 6 modules Basic / Compact size Supports 1xPCIe Gen4 x16 slot + 1x PCIe Gen4 x4 Slot 2x USB4.0 at Type C 4x USB3.0, 2x USB 2.0, and 2x USB 2.0 at 9-pin header for front panel Supports DisplayPort LVDS and eDP* 1x SD card slot* 8-pin header GPIO 1x RJ-45 LAN connector Headers for SMBus, I2 C, LPC Header for front panel usage Onboard diagnostics for BIOS POST code data on LPC bus Note: *Dependent on the module used Specifications BIOS/Debug POST LEDs Onboard diagnostics for BIOS POST code data and address on LPC bus Secondary BIOS Onboard socket for secondary SPI flash Audio Audio Codec Realtek ALC262 Interface Mic/Line-in/Line-out on Rear I/O S/PDIF on Rear I/O Digital I/O SMBus to GPIO bridge LAN GbE controllers 1x 2500/1000/100/10BASE-T compatible RJ45 on Rear I/O. FAN 1x 4-pin FAN connector (from COMe module) 2x 4-pin FAN connector (from Super I/O) Connectors and Interfaces COM Express: 1x 220-pin (Type 10) LVDS: 1x onboard header* Display Port: 1x onboard header Audio: Mic/Line-in/Line-out on I/O panel SATA: 2x SATA connector (SATA_0 and SATA_1) Connectors and Interfaces (one supports mSATA cards) USB 2x USB 4.0 at Type C on Rear I/O 4x USB 3.0 on I/O panel 2x USB 2.0 on I/O panel 2x USB 2.0 at 9-pin header for front panel Expansion busses 1x PCIe Gen4 x16 slot 1x PCIe Gen3 x4 slot 4x PCIe Gen3 x1 slot SATA 4x SATA on the carrier* Serial Port 1x DB-9 (from Super I/O) on Rear I/O 3x 10-pin header GPIO 8-pin header GPIO, SD card slot* Module control bus SMBus, I2C Flat Panel 34-pin header LVDS (build option for eDP)* VGA DB15 on Rear I/O* Miscellaneous Buttons (On/Off, Reset, Seep, Lid), LEDs, Buzzer Buttons Reset button Lid button Sleep button Power button Power 100-240V * The Interface and signal compatibility is subject to the module and carrier used. Mechanical and Environmental Form Factor: PICMG® COM Express® Rev. 3.1 (Supports Type 6 modules Basic/Compact size) Dimensions: 305 mm x 244 mm Operating Temperature: Standard: 0°C to 60°C Rugged: -40°C to 85°C (optional) Humidity: 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration: IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Functional Diagram