COM Express Type 6 Raptor Lake-P COM Express COM.0 R3.1 Type 6 Module based on Intel® Raptor Lake-P platform This page aims to highlight the capabilities of the COM Express Type 6 Raptor Lake-P module. For a more comprehensive information, please refer to its user manual. Download User Manual Features Performance hybrid architecture (P-core, E-core). Up to 14 cores, 20 threads at 15W/28W/45W TDP. AI inference (AVX-512 VNNI, Iris Xe GPU 96EUs). Up to 64GB DDR5 SO-DIMM at max. 4800MT/s, non-ECC. 4x displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4. (opt.) Expansion Busses 1x PCIe x8 Gen4, only available for the 45W SKU 2x PCIe x4 Gen4 & 8x PCIe x1 Gen3 Specifications Core System Core System (SoC) 13th Gen Intel® Core™ processors (formerly Raptor Lake-P). Processor Cores/Threads Cache TDP Graphics Core™ i7-13800HE 6P+8E/20T 24MB 45W(35W cTDP) Iris Xe GPU Core™ i5-13600HE 4P+8E/16T 18MB 45W(35W cTDP) Iris Xe GPU Core™ i3-13300HE 4P+4E/12T 12MB 45W(35W cTDP) UHD GPU Please check the user manual for more CPU SKU. Memory Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s. 2 memory channels with 1DPC design. Video GPU Core Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs GPU Feature Support Intel® Iris Xe or UHD Graphics Core Architecture. Supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA. Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60 Hardware video encode/decode. Up to 8K60 HEVC DirectX 12. OpenGL 4.6, Vulkan 1.2. Mesa 3D support. OneVPL. HDCP 2.3. Graphics Hardware Virtualization (SRIOV). **Digital Display Interface 3x DDI supporting DP 1.4a, HDMI 2.1, DVI. VGA Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz. LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode eDP Build option in place of LVDS, 4 lanes, eDP 1.4b. USB4 Max. 2x USB4 in place of DDI 1/2 (HW/BIOS modification by build option). Supports DP 1.4a by DP alternative mode. Thunderbolt 4 capable, depends on carrier board. Audio Chipset Intel® HD Audio integrated in SoC. Audio Codec On carrier Express-BASE6 (ALC886 standard support). Expansion Busses 1x PCIe x8 Gen4 (only available for the 45W SKU) 2x PCIe x4 Gen4 8x PCIe x1 Gen3: 4 PCIex1 Gen3 (configurable to 4 x1, 2 x2, 1 x4, 1 x2 + 2 x1) + 4 PCIex1 Gen3 Other: SMBus (system), I2C (user), LPC bus (via eSPI to LPC bridge IC) Ethernet Intel® MAC/PHY Intel® Ethernet Connection I225 series I225-V default (I225-IT supports TSN, by build option). Interface 2.5GbE and 1000/100/10 Mbit/s Ethernet connection. Multi I/O and storage USB 4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7). Max. 2x USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable. SATA 2x SATA 6Gb/s (SATA 0-1). Serial 2x UART ports with console redirection. GPIO 4x GPO and 4x GPI (GPI with interrupt) TPM Chipset Infineon solution. Type TPM 2.0 (SPI based). SEMA® Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option). Debug Header 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs. Power Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%. Wide Input ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V. Management ACPI 5.0 compliant, Smart Battery support. Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5). ECO mode Supports deep S5 mode for power saving. Mechanical and Environmental Form Factor PICMG COM Express Rev 3.1, Type 6. Dimensions Mini size: 125 mm x 95 mm. Operating Temperature Standard: 0°C to 60°C (storage: -20°C to 80°C). Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs). Humidity 5-90% RH operating, non-condensing. 5-95% RH storage (and operating with conformal coating). Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27. MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D. HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Windows 10 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit.