COM Express Type 6 Raptor Lake-P

COM Express COM.0 R3.1 Type 6 Module based on Intel® Raptor Lake-P platform

This page aims to highlight the capabilities of the COM Express Type 6 Raptor Lake-P module. For a more comprehensive information, please refer to its user manual.

Download User Manual


  • Performance hybrid architecture (P-core, E-core).
  • Up to 14 cores, 20 threads at 15W/28W/45W TDP.
  • AI inference (AVX-512 VNNI, Iris Xe GPU 96EUs).
  • Up to 64GB DDR5 SO-DIMM at max. 4800MT/s, non-ECC.
  • 4x displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4. (opt.)
  • Expansion Busses
    • 1x PCIe x8 Gen4, only available for the 45W SKU
    • 2x PCIe x4 Gen4 & 8x PCIe x1 Gen3


Core System

Core System (SoC)

  • 13th Gen Intel® Core™ processors (formerly Raptor Lake-P).
Processor Cores/Threads Cache TDP Graphics
Core™ i7-13800HE 6P+8E/20T 24MB 45W(35W cTDP) Iris Xe GPU
Core™ i5-13600HE 4P+8E/16T 18MB 45W(35W cTDP) Iris Xe GPU
Core™ i3-13300HE 4P+4E/12T 12MB 45W(35W cTDP) UHD GPU

Please check the user manual for more CPU SKU.


  • Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s.
  • 2 memory channels with 1DPC design.


GPU Core

  • Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs

GPU Feature Support

  • Intel® Iris Xe or UHD Graphics Core Architecture.
  • Supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA.
  • Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60 Hardware video encode/decode.
  • Up to 8K60 HEVC DirectX 12.
  • OpenGL 4.6, Vulkan 1.2.
  • Mesa 3D support.
  • OneVPL.
  • HDCP 2.3.
  • Graphics Hardware Virtualization (SRIOV).

**Digital Display Interface

  • 3x DDI supporting DP 1.4a, HDMI 2.1, DVI.


  • Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz.


  • Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode


  • Build option in place of LVDS, 4 lanes, eDP 1.4b.


  • Max. 2x USB4 in place of DDI 1/2 (HW/BIOS modification by build option).
  • Supports DP 1.4a by DP alternative mode.
  • Thunderbolt 4 capable, depends on carrier board.



  • Intel® HD Audio integrated in SoC.

Audio Codec

  • On carrier Express-BASE6 (ALC886 standard support).

Expansion Busses

1x PCIe x8 Gen4 (only available for the 45W SKU)

2x PCIe x4 Gen4

8x PCIe x1 Gen3: 4 PCIex1 Gen3 (configurable to 4 x1, 2 x2, 1 x4, 1 x2 + 2 x1) + 4 PCIex1 Gen3

Other: SMBus (system), I2C (user), LPC bus (via eSPI to LPC bridge IC)


Intel® MAC/PHY

  • Intel® Ethernet Connection I225 series
  • I225-V default (I225-IT supports TSN, by build option).


  • 2.5GbE and 1000/100/10 Mbit/s Ethernet connection.

Multi I/O and storage


  • 4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7).
  • Max. 2x USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable.


  • 2x SATA 6Gb/s (SATA 0-1).


  • 2x UART ports with console redirection.


  • 4x GPO and 4x GPI (GPI with interrupt)



  • Infineon solution.


  • TPM 2.0 (SPI based).

SEMA® Board Controller

  • Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option).

Debug Header

  • 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs.


Standard Input

  • ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%.

Wide Input

  • ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V.


  • ACPI 5.0 compliant, Smart Battery support.

Power States

  • C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5).

ECO mode

  • Supports deep S5 mode for power saving.

Mechanical and Environmental

Form Factor

  • PICMG COM Express Rev 3.1, Type 6.


  • Mini size: 125 mm x 95 mm.

Operating Temperature

  • Standard: 0°C to 60°C (storage: -20°C to 80°C).
  • Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs).


  • 5-90% RH operating, non-condensing.
  • 5-95% RH storage (and operating with conformal coating).

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27.
  • MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D.


  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Windows 10 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit.