COM Express Type 7 Ryzen V3000 Dev Kit COM Express VR7 module based on AMD Embedded Ryzen V3000 Platform This page aims to highlight the capability of the COM Express VR7 module. For the comprehensive information please refer to the user manual. Download User Manual Features 8 Cores at 15W/45W — Best Performance per Watt in its class COM Express Rev.3.1 Up to 64GB (2x32GB) DDR5 SO-DIMM at 4800 MT/s, ECC 14x PCIe Gen4 lanes 2x 10G Ethernet, 1x 2.5G Ethernet Extreme Rugged operating temperature: -40°C to 85°C (selected SKU) Specifications Core System Core System (SoC) AMD Embedded Ryzen V3000 Processor Processor Cores/Threads Cache TDP Graphics V3C48 8C/16T 16GB 45W Iris Xe GPU V3C18I 8C/16T 16GB 15W Iris Xe GPU Please check the user manual for the comprehensive CPU SKU. Memory Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s. Expansion Busses x8 PCI Express Gen4: Lanes 16-23 (configurable to one x8, two x4, two controller) x4 PCI Express Gen4: Lanes 0-3 (configurable to four x1, two x2, one x4, four controller) x2 PCI Express Gen4: Lanes 4-5 (configurable to one x1, one x2, one controller) Ethernet 10G-KR Ethernet AMD 10G Ethernet controller integrated in CPU. 2x 10GBASE-KR and sideband signals. Ethernet Intel® Ethernet Controller I226 Series Up to 2.5GbE, 1000/100/10 Mbit/s connections. Multi I/O and Storage USB 4x USB 3.0/2.0/1.1(USB 0-3) SATA 2x SATA 6Gb/s (SATA 0-1) UART 2x UART ports with console redirection Serial 2x UART ports with console redirection GPIO/SD 4xGPO and 4xGPI(GPI with interrupt TBC) Super I/O Supported on the carrier(Standard support: Nuvoton W83627DHG-P) Trusted Platform Module (TPM) Chipset Infineon solution. Type TPM 2.0 (SPI bus based). SEMA® Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option). Debug Header 40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs Power Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%. Wide Input ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V. Management ACPI 5.0 compliant. Power States C0-C3, S0, S5, S5 ECO mode (Wake-on-USB S3, WoL S3/S5) (TBC) ECO mode Supports deep S5 mode for 5Vsb power saving. Mechanical and Environmental Form Factor PICMG COM Express Rev 3.1 (COM.0 R3.1), Type 7 Dimensions Basic size 125 x 95 mm Operating Temperature Standard: 0°C to 60°C (storage: -20°C to 80°C). Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs). Humidity 5-90% RH operating, non-condensing. 5-95% RH storage (and operating with conformal coating). Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27. MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D. HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Yocto Linux, Ubuntu 22.04.3 LTS (TBC)