Module Introduction

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The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

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SMARC module and carrier specifications are

module and carrier specifications are
available online at : https://www.sget.org/standards/smarc

Features

  • Dual, Quad or Octa-core Intel Atom® Series
  • SMARC revision 2.1.1 compliant
  • Up to 16GB LPDDR5
  • Dual-channel LVDS (18/24-bit, optional)
  • 4K DP++, DP++/HDMI
  • 1x SATA Gen 3 / onboard eMMC up to 256 GB
  • 2x CAN bus
  • 2x 2.5GbE ports (TSN capable on Embedded-ER SKUs)
  • USB3/USB2 interfaces
  • 10 year product availability

Specifications

Core System

CPU

  • Intel Atom® x7433RE, 4 cores, 9W TDP

Note: We also have other versions

  • Intel Core i3-N305, 8 cores, 15W TDP
  • Intel N97, 4 cores, 12W TDP
  • Intel N50, 2 cores, 6W TDP
  • Intel Atom® x7835RE, 8 cores, 12W TDP
  • Intel Atom® x7211RE, 2 cores, 6W TDP

Memory

  • 4, 8, 16 GB LPDDR5

Cache

  • 6 MB

Security

  • Intel® Boot Guard
  • Intel® OS Guard
  • Intel® VT-x with Extended Page Tables (EPT)
  • Intel® AES-New Instruction, Intel® SHA Extensions
  • Intel® Virtualization Technology (Intel® VT-x)
  • Intel® Virtualization Technology for Directed I/O (VT-d)
  • Optional TPM 2.0 module

Video

GPU Core

  • Intel® UHD Graphics

GPU Feature Support

  • 12th Gen Intel® graphics core architecture with up to 32 EUs (selected SKUs)
    • Supports 3x independent display 2D and 3D graphics hardware acceleration
    • Supports DirectX 12, OpenGL 4.2, OpenCL 1.2, Video decode HW acceleration for H.265/ HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9, Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MV

LVDS

  • Dual Channel LVDS 18/24 bit

System Storage

eMMC

  • 32, 64, 128 or 256 GB (build option)
  • Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1

SATA

  • 1x SATA Gen3

SEMA® Board Controller

  • Supports: Voltage/Current monitoring, Power Sequencing, Logistics, Forensic Information, Flat Panel Control, I²C Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer, and Fan Control

Debug Header

  • 30-pin multipurpose flat cable connector for use with optional DB-30 debug module
  • Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration

Audio

Audio Codec

  • HDA Audio codec (on carrier)

Dual Ethernet

Primary LAN

  • 10/100/1000/ 2.5 Gbit Ethernet with TSN

Secondary LAN

  • 10/100/1000/ 2.5 Gbit Ethernet with TSN

Extension Busses

USB

  • 2x USB 3.2, 4x USB 2.0

UART

  • 4x UART interfaces SER0/SER 2 (TX/RX/RTS/CTS) / SER1/SER3 (TX/RX)

CAN

  • 2x CAN2.0B only or mixed CAN2.0B, data bit rate up to 8 Mbps

SPI

  • 2x SPI

I²C

  • 4x I2C interfaces

    • Support for 7-bit and 10-bit address mode
    • Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

  • 14x GPIO with interrupt, one GPIO with PWM

PCle

  • 4x PCIe x1 Gen3

MIPI

  • CSI0 2 lanes, CSI1 4 lanes

Power

Input

  • 5Vdc +/- 5%

Mechanical and Environmental

Form Factor

  • SGET SMARC Specifications 2.1

Dimensions

  • SMARC short size module, 82 mm x 50 mm

Operating Temperature

  • Standard: 0°C to +60°C
  • Rugged: -40°C to +85°C (Embedded SKUs only)

Humidity

  • 5-95% RH operating, non-condensing
  • 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALT

  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Yocto Linux BSP, Microsoft Windows

Extended Support (BSP)

  • VxWorks