Module Introduction Download Datasheet The SMARC FormfactorThe SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm. The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key). The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. SMARC module and carrier specifications are module and carrier specifications areavailable online at : https://www.sget.org/standards/smarc SpecificationsCore SystemSoC NXP i.MX8M Plus with Quad core ARM Cortex-A53 TrustZone technology supports ARMv8 Cryptography Extensions 2.3 TOPS Neural Processing Unit (optional) Memory 2/4/8GB LPDDR4L-4266 L2 Cache 512KB system L2 cache (ECC) Security Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR Arm® TrustZone® (TZ) architecture: Cortex®-A53 MPCore TrustZone® support On-chip RAM (OCRAM) secure region protection using OCRAM controller High Assurance Boot (HAB) Cryptographic Acceleration and Assurance Module (CAAM) Capable to support Widevine and PlayReady content protection Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms Real-time integrity checker (RTIC) DRM support for RSA, AES, 3DES, DES Side channel attack resistance True random number generation (RNG) Manufacturing protection support / Secure Non-Volatile Storage (SNVS) TPM Optional TPM 2.0 security MIPI-DSI 1x MIPI-DSI 4 lanes Cameras MIPI-CSI RX Interface Compatible with the MIPI Alliance Interface specification v1.0 Up to 4 data lanes, 1.0Gbps maximum data rate per lane Supports MIPI-HS, MIPI-LP mode 1x MIPI-CSI dual lane interface 1x MIPI-CSI quad lane interface VideoGPU Core Vivante GC7000UL GPU Feature Support GC7000UL (2 shaders), OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL 1.2; GC380 (2D) VPU Feature Support 1080p60 VP9 Profile 0, 2 (10 bit) decoder (Hantro G2), input video stream can be 10-bit, the output decoded video is always 8-bit after post-processing in G2 core 1080p60 HEVC/H.265 decoder (Hantro G2) 1080p60 AVC/H.264 Baseline, Main, High decoder (Hantro G1) 1080p60 VP8 decoder (Hantro G1) The video encoding features include: 1080p60 AVC/H.264 Encoder 1080p60 HEVC/H.265 Encoder NPU 2.3 TOP/s Neural Network performance HDMI HDMI 2.0a MIPI DSI DSI 4 lanes LVDS Dual Channel LVDS port 18/24 bit Camera support Compatible with the MIPI Alliance Interface specification v2.1 Two MIPI-CSI2 camera inputs, one 4-lane and one 2-lane AudioAudio Codec I2S audio codec (located on carrier) Dual EthernetPrimary LAN MAC 10/100/1000 Ethernet Controller on SoC (TSN capable) Secondary LAN MAC 10/100/1000 Ethernet Controller on SoC Wireless CommunicationWi-Fi IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN Bluetooth Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR) Extension BussesPCIe 2x PCIe x1 Gen2.1 * USB 2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG * UART Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS) CAN 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps SPI 2x SPI I2S 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support) I2C Four I2C interfaces Support for 7-bit and 10-bit address mode Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus GPIO 14x GPIO with interrupt, one GPIO with PWM System StorageSDIO 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 eMMC 16, 32, 64 or 128 GB (build option) Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1 SEMA® Board Controller Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer Debug Header 30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration PowerInput 5Vdc +/- 5% Mechanical and EnvironmentalForm Factor SGET SMARC Specifications 2.1 Dimensions SMARC short size module, 82mm x 50mm Operating Temperature Standard: 0°C to +60°C Rugged: -20°C to +85°C (optional) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating SystemsStandard Support Yocto Linux BSP, Android Extended Support (BSP) VxWorks