Module Introduction

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The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

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SMARC module and carrier specifications are

module and carrier specifications are
available online at : https://www.sget.org/standards/smarc

Specifications

Core System

SoC

  • NXP i.MX8M Plus with Quad core ARM Cortex-A53
  • TrustZone technology supports ARMv8 Cryptography Extensions
  • 2.3 TOPS Neural Processing Unit (optional)

Memory

  • 2/4/8GB LPDDR4L-4266

L2 Cache

  • 512KB system L2 cache (ECC)

Security

  • Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR

  • Arm® TrustZone® (TZ) architecture: Cortex®-A53 MPCore TrustZone® support

  • On-chip RAM (OCRAM) secure region protection using OCRAM controller

  • High Assurance Boot (HAB)

  • Cryptographic Acceleration and Assurance Module (CAAM)

  • Capable to support Widevine and PlayReady content protection

  • Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms

  • Real-time integrity checker (RTIC)

  • DRM support for RSA, AES, 3DES, DES

  • Side channel attack resistance

  • True random number generation (RNG)

  • Manufacturing protection support / Secure Non-Volatile Storage (SNVS)

TPM

  • Optional TPM 2.0 security

MIPI-DSI

  • 1x MIPI-DSI 4 lanes

Cameras

  • MIPI-CSI RX Interface
  • Compatible with the MIPI Alliance Interface specification v1.0
  • Up to 4 data lanes, 1.0Gbps maximum data rate per lane
  • Supports MIPI-HS, MIPI-LP mode
  • 1x MIPI-CSI dual lane interface
  • 1x MIPI-CSI quad lane interface

Video

GPU Core

  • Vivante GC7000UL

GPU Feature Support

  • GC7000UL (2 shaders), OpenGL ES 2.0/3.0/3.1, Vulkan,
  • OpenCL 1.2; GC380 (2D)

VPU Feature Support

  • 1080p60 VP9 Profile 0, 2 (10 bit) decoder (Hantro G2),

  • input video stream can be 10-bit, the output decoded

  • video is always 8-bit after post-processing in G2 core

  • 1080p60 HEVC/H.265 decoder (Hantro G2)

  • 1080p60 AVC/H.264 Baseline, Main, High decoder (Hantro G1)

  • 1080p60 VP8 decoder (Hantro G1)

  • The video encoding features include:

    • 1080p60 AVC/H.264 Encoder

    • 1080p60 HEVC/H.265 Encoder

NPU

  • 2.3 TOP/s Neural Network performance

HDMI

  • HDMI 2.0a

MIPI DSI

  • DSI 4 lanes

LVDS

  • Dual Channel LVDS port 18/24 bit

Camera support

  • Compatible with the MIPI Alliance Interface specification v2.1

  • Two MIPI-CSI2 camera inputs, one 4-lane and one 2-lane

Audio

Audio Codec

  • I2S audio codec (located on carrier)

Dual Ethernet

Primary LAN

  • MAC 10/100/1000 Ethernet Controller on SoC (TSN capable)

Secondary LAN

  • MAC 10/100/1000 Ethernet Controller on SoC

Wireless Communication

Wi-Fi

  • IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN

Bluetooth

  • Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR)

Extension Busses

PCIe

  • 2x PCIe x1 Gen2.1 *

USB

  • 2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG *

UART

  • Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS)

CAN

  • 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

SPI

  • 2x SPI

I2S

  • 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

I2C

  • Four I2C interfaces

  • Support for 7-bit and 10-bit address mode

  • Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

  • 14x GPIO with interrupt, one GPIO with PWM

System Storage

SDIO

  • 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

eMMC

  • 16, 32, 64 or 128 GB (build option)
  • Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1

SEMA® Board Controller

  • Voltage/current monitoring, boot configuration, logistics and forensic

information, flat panel control, watchdog timer

Debug Header

  • 30-pin multipurpose flat cable connector for use with optional DB-30 debug module

  • Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration

Power

Input

  • 5Vdc +/- 5%

Mechanical and Environmental

Form Factor

  • SGET SMARC Specifications 2.1

Dimensions

  • SMARC short size module, 82mm x 50mm

Operating Temperature

  • Standard: 0°C to +60°C

  • Rugged: -20°C to +85°C (optional)

Humidity

  • 5-90% RH operating, non-condensing

  • 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

  • Method 213B, Table 213-I, Condition A and Method 214A,

  • Table 214-I, Condition D

HALT

  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Yocto Linux BSP, Android

Extended Support (BSP)

  • VxWorks