Overview I-Pi Dev Kits I-Pi development kits come with an open-standard Computer-on-Module consisting the core elements such as the CPU and memory, along with a general-purpose carrier board with pre-defined I/O interfaces, such as PCIe, USB, and display. I-Pi devkits empower customers to not only test out the performance process of new silicon as they come out, but also prototype for custom, application-specific solutions, turning innovative ideas into proof of concept. COM Express Type 7 Ryzen V3000 + IPMI Dev Kit ADLINK’s Type 7 V3000 + IPMI is an out-of-the-box ready development kit, including a COM.0 R3.1-compliant COM Express Module + Carrier + Heatsink + BMC Module + Optional 10G Ethernet Card, that is powered by AMD Embedded Ryzen V3000 series processor (V3C18I) and ASPEED AST2600 BMC. It suits for the edge application who need best performance/Watt feature and higher manageability The AMD Embedded Ryzen V3000 processor (V3C18I) offers 8 Cores,16 Threads at a power consumption of mere 15W, and supports up to 64GB (2x32GB) DDR5 memory at up to 4800MT/s. With its PCIe Gen4 and integrated 2x 10G Ethernet LAN and 1x 2.5G Ethernet LAN, it exhibits outstanding responsiveness, making it suitable for mission-critical applications requiring high-performance and low power consumption, such as edge networking equipment, 5G infrastructure at the edge, video analyses, intelligent surveillance, and industrial automation and control. The BMC module, featuring the AST2600 processor, is readily available and serves as a crucial hardware and software building block designed to accelerate development time. By combining the Ryzen V3000 with the AST2600, products can be efficiently deployed across various environments. In addition, an MMC (Module Management Controller) is placed between CPU and BMC to forward the information, such as CPU temperature, status of core power rail and current to BMC (Board Management Controller) through IPMB. The illustration as shown as below