SBC3-IMX93The SBC3-IMX93 is a 3.5-inch single-board computer designed for industrial applications that require extended temperature ranges and shock-resistant durability. Powered by the advanced i.MX93 microprocessor, it offers enhanced security features and high-performance Cortex-A55 cores. SpecificationsBoard SpecificationsForm factor 3.5” form factor Power supply Voltage range: from 15 to 30 VDC Graphics HDMI over DSI to HDMI bridge (ADV7535) LVDS single-channel USB 3 USB2.0 interfaces (2x type A, 1x microUSB) Communication 2 Gbe ethernet port with TI DP83867IR phy Slow-speed signals 4x PWM / 2x ADC on header (J50) 2x CAN header (JP5 & JP6) 2x I2C on header (J44) 2x SPI on header (J45) 14x GPIO on header (J6) 3x UART on header (J46) Module Interface 1x LGA Footprint: Supports OSM LGA-type modules Graphics and Video HDMI Port: Routed through a DSI to HDMI bridge LVDS Output: Single-channel LVDS to Hirose connector USB Interfaces3x USB ports: 1x OTG (On-The-Go) 2x Host USB 2.0 Backlight Power Selectable 5V or 12V, switchable via jumper LCD Power 3V, 5V, or 12V DC for LCD Networking LAN0 & LAN1: Connected to RJ45 connectors via a PHY. Storage microSD Slot: Connected to SDIO A. Camera Interface CSI Interface: Routed to a 22-pin CSI connector, with 2 lanes available. Audio TI TLV320AIC3106 Audio Codec: Connected to I2S A Communication Dual CAN Interface: Equipped with CAN transceivers on the board for communication. Power Supply The board is powered by a Barrel type connector, accepting 15 to 30 VDC. Mechanical and EnvironmentalForm Factor solder down module SGET OSM Specifications 1.1 Size L Carrier dimension 3.5” standard Operating temperature Standard: 0°C to 60°C / -40°C to 85°C Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D Block Diagram