Module Introduction

The OSM Form Factor

The OSM (“Open Standard Module”) Open Standard Module™ specification facilitates the development, production, and distribution of embedded
modules tailored for renowned MCU32, ARM, and x86 architectures. This standard is increasingly relevant for IoT applications, as it merges the benefits
of modular embedded computing with the growing demands for cost efficiency, compactness, and versatile interfaces.

The modules serve as building blocks for portable and stationary embedded systems. They integrate the core CPU and support circuits, including
DRAM, boot flash, power sequencing, and CPU power supplies. The modules are used with application-specific carrier boards to implement features
such as audio CODECs, touch controllers, wireless devices, PHY, and more. The modular design not only promotes scalability and fast time to market but
also ensures upgradability, all while maintaining low costs, low power consumption, and a compact physical size.

OSM module and carrier specifications are available online at : https://www.sget.org/standards/osm

Features

NXP® i.MX93 series with 2-core Arm Cortex-A55 & M33
In-SoC Arm Ethos U-65 microNPU
OSM revision 1.1 compliant
LVDS, DSI graphic output interfaces
Dual GbE (one TSN capable)
ADC: 2-channel, 12-bit
Rugged operating temperature option: -40°C to 85°C
Dual CAN bus
USB2 interfaces
I2S audio codec interface
15 year product availability

Specifications

Processor & System

CPU

NXP® i.MX93 series with 2-core Arm Cortex-A55 & M33 TrustZone Technology with Armv8 Cryptography Arm® EthosTM U-65 microNPU

Memory

0.5 up to 2GB LPDDR4-solder down

L2 Cache

32kB L1-I, 32kB L1-D, and 64kB L2 cache per core

Security

TRDC – Resource Domain Controller
- Supports up to 16 resource domains
Arm TrustZone® (TZ) architecture
Secure and trusted access control
Battery Backed Security Module (BBSM)
- Monotonic counter - Secure real-time clock (RTC) - Zeroizable Mast

Video

GPU Core

PXP 2D accelerator

MIPI DSI

1x MIPI DSI 4 lanes (up to 1920x1200p60)

LVDS

up to 1366x768p60 or 1280x800p60

Camera

1x 2-lane MIPI CSI-2 Interface:

Compliant with CSI-2 v1.3 and D-PHY v1.2
Supports up to 2 Rx data lanes + 1 clock lane
80 Mbps–1.5 Gbps per lane in high-speed mode
10 Mbps data rate in low-power mode

System Storage

SDIO

1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

eMMC

32, 64, or 128 GB (build option) Compatible with eMMC spec 4.41, 4.51, 5.0, 5.1

Debug Header

JTAG interface

Audio

Audio Codec

I2S audio codec located on carrier

Dual Ethernet

Primary LAN

10/100/1000 Ethernet controller on SoC (TSN capable)

Secondary LAN

10/100/1000 Ethernet controller on SoC

Extension Buses

USB

3x USB 2.0, 1x USB 2.0 OTG (Optional USB hub available)

UART

4x UART interfaces (UART A/B has TX/RX/CTS/RTS; C has TX/RX; plus 1 console)

CAN

2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

SPI

2x SPI

I²S

1x I²S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192kHz (see Audio Codec support)

I²C

2x I²C interfaces

Support for 7-bit and 10-bit address mode
Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 Kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

14x GPIO with interrupt

Power

Input

5V DC +/- 5%

Mechanical and Environmental

Form Factor

SGET OSM Specifications 1.1

Dimension

OSM Size-L (Large) module 45 mm x 45 mm

Operating Temperature

Standard: 0°C to 60°C
Rugged: -40°C to 85°C

Humidity

5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 2138, Table 213-1, Condition A and Method 214A, Table 214-1, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

Yocto Linux BSP

Extended Support (BSP)

Foundries.IO