I-Pi SMARC 1200 SMARC 2.1.1 module with I-Pi SMARC Plus Carrier BoardIndustrial Prototyping Kit for IoT/AIoT and robotics with Off-the-Shelf SMARC Computer-on-Module SMARC 2.1.1 Carrier Board with dual M.2 Extension connectors. Features SMARC 2.1.1 compliant, specially designed for industrial embedded applications requiring long life, high MTBF and strict revision control Includes everything needed to go live in minutes Industrial grade quality and 15 year product availability Supports Ubuntu and Yocto OS SpecificationsGraphics and Camera 1x HDMI 1x DP 1x eDP 1x MIPI-DSI 4 lanes LVDS dual channel 1x MIPI-CSI dual lane interface 2x MIPI-CSI quad lane interface (CSI 3 located on module) Audio Interchangeable audio codec connector with I2S and HDA signals Dual Ethernet 1x 10/100/1000 RJ45 connector 1x 10/100/1000 RJ45 connector (optional) Expansion Busses 2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG connectors 4x UART interfaces SER2 (TX/X/CTS/RTS) and SER0, SER1, SER3 (TX/RX) 1x CAN interface via pin headers 2x SPI pin headers (If can populated only 1 SPI available) 1x I²S interface to audio interface 2x I²C interface on pin header 14x GPIO with interrupt on pin header M.2 B-key and M.2 E-key expansion slots for additional storage or communication SIM card slot Storage 1x SDIO MicroSD card slot (4-bit) compatible with SD/SDIO standard, up to version 3.0 Buttons 1x Reset button 1x Power button Power 19Vdc input via barrel connector Mechanical and Environmental Form Factor: SGET SMARC Specifications 2.1 Dimensions: 110 mm x 110 mm Operating Temperature: Standard: 0°C to +60°C Rugged: -40°C to +85°C (optional, MOQ applies) Humidity: 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration: IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Block Diagram