Module Introduction


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The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.


SMARC module and carrier specifications are

module and carrier specifications are
available online at :


  • 8-core MediaTek MT8395 (Arm Cortex-A78 x4 + Cortex-A55 x4)
  • 5 TOPS APU system
  • Up to 8GB LPDDR4X
  • SMARC revision 2.1.1 compliant
  • DSI up to 1080P
  • HDMI up to 4K/60
  • 1x onboard UFS up to 256 GB
  • Dual GbE ports
  • 3x CSI interfaces
  • USB3/USB2 interfaces
  • 10 year product availability


Processor & System


  • 8-core MediaTek MT8395 (Arm Cortex-A78 x4 + Cortex-A55 x4)
  • Up to 5 TOPS APU system


  • 4 or 8 GB discrete LPDDR4X


  • 256KB L2 per core (2MB unified L3)

IoT Security

  • TPM 2.0 module (optional)


GPU Core

  • Five-core Arm Mali-G57 GPU

GPU Feature Support

  • 3D graphic accelerator capable of processing 17600M pixel/sec @ 880MHz
  • Support for OpenGL ES 3.2/2.0/1.1, Vulkan 1.1/1.0, OpenCL 2.2


  • Up to 5 TOPS APU system


  • HDMI 2.0b 4K @ 60Hz


  • Dual channel LVDS (optional)


  • 2x 4 Lane DSI, maximum resolution 4K p60 with 24-bit RGB

Camera support

  • 3x MIPI CSI 1x 2 lane, 2x 4 lane


Audio Codec

  • I²S audio codec located on carrier

Dual Ethernet

Primary LAN

  • 10/100/1000 Mbit Ethernet

Secondary LAN

  • 10/100/1000 Mbit Ethernet (optional)

Wireless Communication


  • IEEE 802.11 2X2 MU-MIMO ac/a/b/g/n (optional)


  • Bluetooth 5.0 (optional)

Extension Busses


  • 1x PCIe x2 Gen3


  • 2x USB 3.0, 4x USB 2.0


  • four UART interfaces SER1, 2 (CTS/RTS) / SER0, 3 (TX/RX/CTS/RTS)


  • 1x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps (optional)


  • 2x SPI


  • 1x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)


  • Four I2C interfaces

  • Support for 7-bit and 10-bit address mode

  • Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus


  • 14x GPIO with interrupt, one GPIO with PWM

System Storage


  • 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0


  • Up to 256 GB (build option)

SEMA® Board Controller

  • Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, I²C Bus Control, GPIO Control, Watchdog Timer

Debug Header

  • 30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration



  • 5Vdc +/- 5%

Mechanical and Environmental

Form Factor

  • SGET SMARC Specifications 2.1


  • SMARC short size module, 82mm x 50mm

Operating Temperature

  • Standard: 0°C to 60°C

  • Rugged: -40°C to 85°C (optional)


  • 5-90% RH operating, non-condensing

  • 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

  • Method 213B, Table 213-I, Condition A and Method 214A,

  • Table 214-I, Condition D


  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Canonical Ubuntu
  • Yocto Linux
  • Android 12