LEC-RB5 SMARC 2.1.1 module with I-Pi SMARC Plus Carrier BoardIndustrial Prototyping Kit for IoT/AIoT with Off-the-Shelf SMARC Computer-on-Module SMARC 2.1.1 Carrier Board with M.2 Extension. Features Equipped with SMARC 2.1.1 compliant, specially designed for industrial embedded applications requiring long life, high MTBF and strict revision control Includes everything needed to go live in minutes Industrial grade quality and 15 year product availability Supports Android, Ubuntu and Yocto OS SpecificationsGraphics and Camera 2x HDMI 2x eDP 2x MIPI-DSI 4 lanes LVDS dual channel 2x MIPI-CSI dual lane interface 2x MIPI-CSI quad lane interface Audio Interchangeable audio codec connector with I2S and HDA signals Dual Ethernet 1x 10/100/1000 RJ45 connector 1x 10/100/1000 RJ45 connector Expansion Busses 2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG connectors 4x UART interfaces SER2 (TX/X/CTS/RTS) and SER0, SER1, SER3 (TX/RX) 2x CAN 2 interface pin headers 2x SPI pin headers 1x I²S interface to audio interface 2x I²C interface on pin header 14x GPIO with interrupt on pin header M.2 B-key and M.2 E-key expansion slots for additional storage or communication MicroSD card slot SIM card slot Storage 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Buttons 1x Reset button 1x Power button Power 19Vdc input via barrel connector Mechanical and Environmental Form Factor: SGET SMARC Specifications 2.1 Dimensions: 110 mm x 110 mm Operating Temperature: Standard: 0°C to +60°C Rugged: -40°C to +85°C (optional) Humidity: 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration: IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Block Diagram