Module Introduction


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The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.


SMARC module and carrier specifications are

module and carrier specifications are
available online at :


  • 8-core Qualcomm® Kryo™ 585 CPU (Arm Cortex-A77)
  • 1x onboard UFS up to 256 GB
  • Up to 8GB POP LPDDR4 at 4266 MT/s
  • SMARC revision 2.1.1 compliant
  • DSI up to 1080P
  • HDMI up to 4K/60
  • 1x onboard UFS up to 256 GB
  • Dual GbE ports
  • 6x CSI interfaces
  • USB3/USB2 interfaces
  • 10 year product availability


Processor & System


  • 8-core Qualcomm® Kryo™ 585 CPU (Arm Cortex-A77): 1 Kryo Gold Prime @ 2.84 GHZ + 3 Kryo Gold @ 2.42 GHz + 4 Kryo Silver @ 1.81 GHz
  • Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS


  • 4 or 8 GB POP LPDDR4L-4266


  • Gold Prime core 512 KB
  • Gold core 256 KB
  • Silver core 128 KB


  • Qualcomm Secure Processing Unit


  • TPM 2.0 module (optional)


GPU Core

  • Adreno™ GPU 650

GPU Feature Support

  • OpenGL ES 3.2, Vulkan 1.1
  • DX12 FL 12_1OpenCL 2.0 full profile Support for DirectX 12, OpenGL 4.2
  • OpenCL 1.2 Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/ MJPEG, VP8, VP9Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MV


  • Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS


  • HDMI 2.0b 1K@60 Hz


  • 4 Lane DSI,Maximum resolution 1K p60 with 24-bit RGB

Camera support

  • 6x CSI interfaces


Audio Codec

  • I2S audio codec located on carrier

Dual Ethernet

Primary LAN

  • 10/100/1000 Mbits Ethernet

Secondary LAN

  • 10/100/1000 Mbits Ethernet

Wireless Communication

Wi-Fi (optional)

  • IEEE 802.11 2X2 MU-MIMO ac/a/b/g/n

Bluetooth (optional)

  • Bluetooth 5.0

Extension Busses


  • 2x PCIe x2 Gen3


  • 2x USB 3.0, 4x USB 2.0


  • Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS)


  • 1x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps (optional)


  • 2x SPI


  • 1x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)


  • Three I2C interfaces

  • Support for 7-bit and 10-bit address mode

  • Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus


  • 14x GPIO with interrupt, one GPIO with PWM

System Storage


  • 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0


  • Up to 256 GB (build option)
  • Compatible with UFS gear 2.1 or 3.0

SEMA® Board Controller

  • Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, I²C Bus Control, GPIO Control, Watchdog Timer

Debug Header

  • 30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration



  • 5Vdc +/- 5%

Mechanical and Environmental

Form Factor

  • SGET SMARC Specifications 2.1


  • SMARC short size module, 82mm x 50mm

Operating Temperature

  • Standard: 0°C to +60°C

  • Rugged: -20°C to +85°C (optional)


  • 5-90% RH operating, non-condensing

  • 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

  • Method 213B, Table 213-I, Condition A and Method 214A,

  • Table 214-I, Condition D


  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Canonical Ubuntu
  • Yocto Linux