COM Express Type 10 Mini Carrier Board

Industrial Prototyping / Reference Carrier for Off-the-shelf COM Express Type 10 Module


Download Datasheet


  • Carrier board for ADLINK Type 10 modules (excluding nano-TC/TCR)

  • 2x USB 3.0, 2x USB 2.0, and 1x USB client

  • Supports DisplayPort and LVDS (eDP optional)

  • 1x SD card slot*

  • 8-pin header GPIO

  • 2x Mini PCIe card slots (one supports mSATA cards)

  • 2x RJ-45 LAN connectors

  • Conforms to COM Express Carrier Design Guide rev. 2.0

  • Supports Smart Battery and 19V adapter power supply

Note: *Features’ availability depend on the module used.



  • Onboard diagnostics for BIOS POST code data and address on LPC bus
Secondary BIOS
  • Onboard socket for secondary SPI flash


Audio Codec
  • Realtek ALC262
  • 3-in-1 connector, Mic/Line-in/Line-out, on Rear I/O
Digital I/O
  • SMBus to GPIO bridge


GbE controllers
  • Dual Intel GbE Controller i210 (one from the module, one from the carrier board)

Connectors and Interfaces

  • COM Express: 1x 220-pin (Type 10)
  • LVDS: 1x onboard header
  • Display Port: 1x onboard header
  • Audio: Mic/Line-in/Line-out on I/O panel
  • SATA: 1x SATA connector
  • Connectors and Interfaces (one supports mSATA cards)
  • LAN: 2x LAN supports, 10/100/1000BASE-T compatible RJ-45 on I/O panel
  • 2x USB 3.0 on I/O panel
  • 2x USB 2.0 on I/O panel
  • 1x USB client
Serial Port
  • 2x DB-9 on I/O panel
SD Card
  • 1x socket onboard
Smart Battery
  • 1x 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board)

GPIO 8-pin header

Module control bus

SMBus, I2C


Buttons (On/Off, Reset, Sleep, Lid)

  • Reset button
  • Lid button
  • Sleep button
  • Power button


  • 19Vdc input via barrel connector

Mechanical and Environmental

  • Form Factor: PICMG® COM Express® Revision 2.1 (Supports Type 10 modules in Mini form factor)

  • Dimensions: 150 mm x 142 mm

  • Operating Temperature:

    • Standard: 0°C to 60°C
    • Rugged: -40°C to 85°C (optional)
  • Humidity:

    • 5-90% RH operating, non-condensing

    • 5-95% RH storage (and operating with conformal coating)

  • Shock and Vibration:

    • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,
    • Method 213B, Table 213-I, Condition A and Method 214A,
    • Table 214-I, Condition D
  • HALT

    • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Functional Diagram