COM Express Type 10 Mini Carrier Board Industrial Prototyping / Reference Carrier for Off-the-shelf COM Express Type 10 Module Download Datasheet Features Carrier board for ADLINK Type 10 modules (excluding nano-TC/TCR) 2x USB 3.0, 2x USB 2.0, and 1x USB client Supports DisplayPort and LVDS (eDP optional) 1x SD card slot* 8-pin header GPIO 2x Mini PCIe card slots (one supports mSATA cards) 2x RJ-45 LAN connectors Conforms to COM Express Carrier Design Guide rev. 2.0 Supports Smart Battery and 19V adapter power supply Note: *Features’ availability depend on the module used. Specifications BIOS/Debug POST LEDs Onboard diagnostics for BIOS POST code data and address on LPC bus Secondary BIOS Onboard socket for secondary SPI flash Audio Audio Codec Realtek ALC262 Interface 3-in-1 connector, Mic/Line-in/Line-out, on Rear I/O Digital I/O SMBus to GPIO bridge LAN GbE controllers Dual Intel GbE Controller i210 (one from the module, one from the carrier board) Connectors and Interfaces COM Express: 1x 220-pin (Type 10) LVDS: 1x onboard header Display Port: 1x onboard header Audio: Mic/Line-in/Line-out on I/O panel SATA: 1x SATA connector Connectors and Interfaces (one supports mSATA cards) LAN: 2x LAN supports, 10/100/1000BASE-T compatible RJ-45 on I/O panel USB 2x USB 3.0 on I/O panel 2x USB 2.0 on I/O panel 1x USB client Serial Port 2x DB-9 on I/O panel SD Card 1x socket onboard Smart Battery 1x 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board) GPIO GPIO 8-pin header Module control bus SMBus, I2C Miscellaneous Buttons (On/Off, Reset, Sleep, Lid) Buttons Reset button Lid button Sleep button Power button Power 19Vdc input via barrel connector Mechanical and Environmental Form Factor: PICMG® COM Express® Revision 2.1 (Supports Type 10 modules in Mini form factor) Dimensions: 150 mm x 142 mm Operating Temperature: Standard: 0°C to 60°C Rugged: -40°C to 85°C (optional) Humidity: 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration: IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Functional Diagram