COM Express Type 10 Elkhart Lake

COM Express Mini Size Type 10 Module with Atom® x6000


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  • Quad-core Intel Atom® Processor SoC
  • Burst Frequency up to 3.0GHz
  • Intel® Gen11 LP GFX for AI inference based on OpenVINO
  • Up to 16GB LPDDR4 at up to 4267 MT/s
  • TCC and TSN
  • 10-years product availability


Core System


  • Intel Atom® X6211E 1.30GHz (3.0GHz Burst) 6W (2C/16EU, IBECC/non-ECC)

Note: We also have other versions and TCC/IBECC requires specific settings on BIOS (by project basis)

  • Intel Atom® x6425E 1.8GHz (3.0GHz Burst) 12W (4C/32EU, IBECC/non-ECC)
  • Intel Atom® x6413E 1.5GHz (3.0GHz Burst) 9W (4C/16EU, IBECC/non-ECC)
  • Intel Atom® x6211E 1.2GHz (3.0GHz Burst) 6W (2C/16EU, IBECC/non-ECC)
  • Intel Atom® x6425RE 1.9GHz 12W (4C/32EU, IBECC/non-ECC)
  • Intel Atom® x6414RE 1.9GHz 9W (4C/16EU, IBECC/non-ECC)
  • Intel Atom® x6412RE 1.5GHz 6W (2C/16EU, IBECC/non-ECC)


  • LPDDR4 soldered memory up to 4267 MT/s, IBECC/non-ECC up to 16GB
  • Memory configuration: 2/4/8/16GB (8/16GB by project basis)


  • 1.5 MB L2 Cache


  • Intel® AES New Instructions
  • Execute Disable Bit
  • Intel® OS Guard
  • Intel® Secure Key
  • Intel® Boot Guard
  • Intel® Virtualization Technology (VT-x)
  • Intel® Virtualization Technology for Directed I/O (VT-d)


GPU Core

  • Intel® Gen11 LP Graphics Core Architecture

GPU Feature Support

  • Intel® Gen11 LP Graphics Core Architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs (max. 4K @60Hz)
  • Hardware encode/transcode of HD content (including HEVC)
  • DirectX 12 and Vulkan v1.1 support
  • OpenGL 4.5 and ES 3.2 support
  • OpenCL 1.2 support


  • DP1.4 4K@60Hz


  • HDMI


  • Single channel 18/24-bit LVDS via eDP-to-LVDS IC


  • Optional 4-lane support, in place of LVDS (by project basis)



  • Intel® HD Audio integrated in SoC

Audio Codec

  • Located on carrier miniBASE-10R



  • 10/100/1000 Ethernet, 2.5GbE (by project basis)

Extension Busses

  • 4 PCIe x1 Gen3: configurable to x1, x2, x4
  • LPC Bus, SMBus, I2C


  • 2x USB 3.0, 2x USB 2.0


  • 2x SATA Gen3 6Gb/s


  • 2x UART ports with console redirection


  • 4x GPO and 4x GPI from EC (GPI with interrupt TBC), SD/GPIO muxed design
  • SD is build option by project basis, SD functions as storage device only

System Storage


  • eMMC 5.0 (32/64GB by build option)

SEMA® Board Controller

  • Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)

Debug Header

  • 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs


Standard Input

  • ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

Wide Input

  • ATX: 4.75-20 V / 5Vsb ±5%; or AT: 4.75-20V


  • ACPI 5.0 compliant, Smart Battery support

Power States

  • S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO mode

  • Supports deep S5 mode for power saving

Mechanical and Environmental

Form Factor

  • PICMG COM.0: Rev 3.0 Type 10


  • Mini size: 84 mm x 55 mm

Operating Temperature

  • Standard: 0°C to 60°C
  • Rugged: -45°C to 85°C (optional)


  • 5-90% RH operating, non-condensing
  • 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

  • IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,
  • Condition A and Method 214A, Table 214-I, Condition D


  • Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

  • Windows 10 IoT Enterprise, Yocto, Ubuntu

Extended Support (BSP)

  • Yocto project based Linux 64-bit